disco corporation equipment for qrindinq of

MJ Series Jaw Crusher

MJ Series Jaw Crusher

MJ series jaw crusher is mainly used as a coarse crushing crusher. Its purpose is to crush rocks into smaller particle sizes for subsequent processing in the crushing section. Because it can effectively…

MC Series Single-Cylinder Hydraulic Cone Crusher

MC Series Single-Cylinder Hydraulic Cone Crusher

MC series single cylinder hydraulic cone crusher is used in secondary and fine crushing operations. It is widely used in metallurgy, construction, highway, chemical and building materials industries. It…

ML Series Vertical Shaft Impact Crusher

ML Series Vertical Shaft Impact Crusher

Vertical shaft impact crusher is often used in the final crushing circuit. Due to the ability to produce fine-grained final products, ML series vertical shaft impact crushing equipment is very popular…

MD Series Multi-Cylinder Hydraulic Cone Crusher

MD Series Multi-Cylinder Hydraulic Cone Crusher

MD series multi-cylinder hydraulic cone crusher is used in the second and third stages of mineral processing and stone crushing, as well as the superfine material crushing of some rocks and ores. MD series…

MF Series Fixed Shaft Circular Vibrating Screen

MF Series Fixed Shaft Circular Vibrating Screen

In order to eliminate the phenomenon of unbalanced vibration, unstable amplitude, on/off bounce, poor screening effect, and cracking of the screen box caused by diagonal vibration in the actual screening…

MGD Series Vibrating Feeder

MGD Series Vibrating Feeder

MGD series vibrating feeder is designed for ultra-heavy working conditions and is suitable for feeding materials to primary jaw crushers, primary impact crushers and primary hammer crushers. It is widely…

Dicing and Grinding Service | Solutions | DISCO Corporation

DISCO Corporation (Head Office: Ota-ku in Tokyo; President: Kazuma Sekiya), a semiconductor manufacturing equipment manufacturer, has developed two types of fully automatic grinders that support diversified package grinding needs.

DISCO Corporation Company Profile

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. ... Surface planners use bit grinding with a diamond bit to realize high-accuracy planarization for ductile materials (Au, Cu, and solder), resin (photoresist, polyimide), and ...

DISCO Corp.

Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface's circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.

Global Semiconductor Wafer Polishing and Grinding ...

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to apply for training

DFD6340 | Dicing Saws | Product Information | DISCO ...

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to apply for training

Thinning by Grinding Wheel (Grinding)| DISCO Technology ...

DISCO CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as well as the maintenance and related ...

그라인딩 | 솔루션 | DISCO Corporation

The TAIKO process is a wafer backgrinding method developed by DISCO. This process method leaves a ring (approximately 3 mm) on the wafer outer edge and thin grinds only the inner area of the backside wafer.

Product Information | DISCO Corporation

READ the operation manual of the cutting/grinding equipment before use. DO NOT USE the precision tooling with modified or customized equipment. DO NOT USE precision tooling that has a different size from the one recommended for your equipment. DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.

ZH05 | Dicing Blades | Product Information | DISCO Corporation

About Disco Corp DISCO CORPORATION manufactures abrasive and precision industrial machinery for cutting and grinding purposes. The Company's products are applied in the semiconductor, electronics ...

IF | Grinding Wheels | Product Information | DISCO Corporation

Customer Equipment Improvement Information (CSMDC) ... 초박형 웨이퍼 마무리 연삭(Ultra-Thin Grinding) 최근 휴대폰 등의 디지털 모바일기기에 사용되는 SiP(System in Package)등의 보급에 따라, 100 µm 이하의 웨이퍼 두께로 제품의 효율을 좋게 실현하는 박화 연삭기술이 주목 받고 ...

Solutions | DISCO Corporation

Enhanced dicing throughput. The DFD6361 enhances throughput in two distinct ways. DISCO's facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade …

Manual for Old Equipment | Support | DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to apply for training

Manual Downloads | Product Information | DISCO Corporation

DISCO Corp. engages in the manufacturing and sale of precision cutting, grinding and polishing machines. It operates through the following business divisions: Precision Machines, Precision ...

Ring Grinding | Grinding | Solutions | DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to apply for training

Delivery Flow | Dicing and Grinding Service | Solutions ...

Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface's circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.

Dicing and Grinding Using the ...

Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.

6146:Tokyo Stock Quote

DISCO Corporation. Join Date: Jan 1, 1976. Company ID: 10462. Dicing equipment; grinding equipment and related consumables for materials processing. Primary Industry. Semiconductor, Photonics. Primary Product Category. Equipment and …

Processing of Ceramics (HTCC / LTCC) | DISCO Technology ...

Company profile for solar equipment manufacturer Disco Corporation - showing the company's contact details and products manufactured. ... Disco Disco Corporation 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 +81 3 45901111: ... Wafer Grinding Equipment, Wafer Polishing Machine Last Update 10 Apr 2020 ...

DAD3360 | Dicing Saws | Product Information | DISCO ...

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to apply for training

Others | Solutions | DISCO Corporation

Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines. The Company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.

CP alignment | Blade Dicing | Solutions | DISCO Corporation

This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are not shown here.

DAD3350 | Dicing Saws | Product Information | DISCO ...

We are introducing a grinding method, which grinds the ring section of a wafer, in the TAIKO process. When mounting a TAIKO wafer onto dicing tape, if the height difference between the ring section and TAIKO section is big, a large void is generated between the tape and wafer, which has a negative impact on the dicing.

Disco Corporation | Production Equipment | Japan

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to apply for training

DFM2800 | Wafer Mounter | Product Information | DISCO ...

DISCO Corporation (ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding …

Grinding Wheels suitable for GaAs Wafers | Grinding ...

Jan 27, 2021· The report "Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Region (North America, Europe, Asia Pacific, Latin America, and Mid Wednesday, January 27 2021 Breaking News

DFS8910 | Surface Planer | Product Information | DISCO ...

DISCO CONFIDENTIAL only for customer ¤2013 DISCO CORPORATION All rights reserved SiC Grinding by GS08 and Dry Polishing 4 Roughness: much finer than commonly used ...

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